{"title":"无源元件的集成:介绍","authors":"G. Van De Walle","doi":"10.1016/S0165-5817(98)00011-4","DOIUrl":null,"url":null,"abstract":"<div><p>The trend of miniaturization of electronic products has had an effect on the development of passive components. A solution to the problems that are generated by size reduction of discrete passive components is to integrate resistors, capacitors and inductors into a functional passive circuit on one substrate. Various conditions have to be fulfilled in order to justify this integration. Important aspects are manufacturing cost, assembly cost, miniaturization, reliability, functionality and performance. Thin film technology can offer many advantages in all these aspects.</p></div>","PeriodicalId":101018,"journal":{"name":"Philips Journal of Research","volume":"51 3","pages":"Pages 353-361"},"PeriodicalIF":0.0000,"publicationDate":"1998-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/S0165-5817(98)00011-4","citationCount":"7","resultStr":"{\"title\":\"Integration of passive components: An introduction\",\"authors\":\"G. Van De Walle\",\"doi\":\"10.1016/S0165-5817(98)00011-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The trend of miniaturization of electronic products has had an effect on the development of passive components. A solution to the problems that are generated by size reduction of discrete passive components is to integrate resistors, capacitors and inductors into a functional passive circuit on one substrate. Various conditions have to be fulfilled in order to justify this integration. Important aspects are manufacturing cost, assembly cost, miniaturization, reliability, functionality and performance. Thin film technology can offer many advantages in all these aspects.</p></div>\",\"PeriodicalId\":101018,\"journal\":{\"name\":\"Philips Journal of Research\",\"volume\":\"51 3\",\"pages\":\"Pages 353-361\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/S0165-5817(98)00011-4\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Philips Journal of Research\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0165581798000114\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Philips Journal of Research","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0165581798000114","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integration of passive components: An introduction
The trend of miniaturization of electronic products has had an effect on the development of passive components. A solution to the problems that are generated by size reduction of discrete passive components is to integrate resistors, capacitors and inductors into a functional passive circuit on one substrate. Various conditions have to be fulfilled in order to justify this integration. Important aspects are manufacturing cost, assembly cost, miniaturization, reliability, functionality and performance. Thin film technology can offer many advantages in all these aspects.
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