微电子用聚合物基复合材料

IF 2.1 4区材料科学 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Polymers & Polymer Composites Pub Date : 2000-01-01 DOI:10.1201/9781420040975-6

D. Chung

{"title":"微电子用聚合物基复合材料","authors":"D. Chung","doi":"10.1201/9781420040975-6","DOIUrl":null,"url":null,"abstract":"Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibres, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity and electromagnetic interference shielding. Applications include heat sinks, housings, printed wiring boards, substrates, lids, die attach, encapsulation, interconnections and thermal interface materials.","PeriodicalId":20322,"journal":{"name":"Polymers & Polymer Composites","volume":null,"pages":null},"PeriodicalIF":2.1000,"publicationDate":"2000-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Polymer-Matrix Composites for Microelectronics\",\"authors\":\"D. Chung\",\"doi\":\"10.1201/9781420040975-6\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibres, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity and electromagnetic interference shielding. Applications include heat sinks, housings, printed wiring boards, substrates, lids, die attach, encapsulation, interconnections and thermal interface materials.\",\"PeriodicalId\":20322,\"journal\":{\"name\":\"Polymers & Polymer Composites\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2000-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymers & Polymer Composites\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1201/9781420040975-6\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymers & Polymer Composites","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1201/9781420040975-6","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}

引用次数: 20

摘要

综述了微电子用聚合物基复合材料的科学研究和应用。它们包括颗粒和纤维形式的连续和不连续填料，设计用于高导热性，低热膨胀，低介电常数，高/低导电性和电磁干扰屏蔽。应用包括散热器，外壳，印刷线路板，基板，盖子，模具附件，封装，互连和热界面材料。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Polymer-Matrix Composites for Microelectronics

Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibres, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity and electromagnetic interference shielding. Applications include heat sinks, housings, printed wiring boards, substrates, lids, die attach, encapsulation, interconnections and thermal interface materials.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Polymers & Polymer Composites 工程技术-材料科学：表征与测试

CiteScore

4.30

自引率

9.50%

发文量

审稿时长

5.7 months

期刊介绍： Polymers & Polymer Composites provides a forum for the publication of expertly peer reviewed, international research into the following topics: - Fibre reinforced and particulate filled plastics - Engineering plastics - Nanocomposites - Polymers or polyblends intended for engineering use (including structural, load bearing electronic and electrical applications) - Fibre reinforced and particulate filled plastics - Structural adhesives - Textile & wood fibres - Biomaterials with a load bearing capacity, (including polymer based dental materials)