一个多标准，多频段SoC集成了BT, FM, WLAN无线电和集成功率放大器

2010 IEEE International Solid-State Circuits Conference - (ISSCC) Pub Date : 2010-03-18 DOI:10.1109/ISSCC.2010.5433962

Chungyeol P. Lee, A. Behzad, B. Marholev, V. Magoon, I. Bhatti, Dandan Li, Subhas Bothra, A. Afsahi, Dayo Ojo, R. Roufoogaran, Tom Li, Yuyu Chang, K. R. Rao, S. Au, Prasad Seetharam, K. Carter, J. Rael, Malcolm Macintosh, Bobby Lee, M. Rofougaran, R. Rofougaran, A. Hadji-Abdolhamid, M. Nariman, S. Khorram, S. Anand, E. Chien, Steve Wu, Carol Barrett, Lijun Zhang, A. Zolfaghari, H. Darabi, Ali Sarfaraz, B. Ibrahim, M. Gonikberg, Marcellus Forbes, Colin Fraser, Luis Gutierrez, Yury Gonikberg, M. Hafizi, Siukai Mak, Jesse Castaneda, Kimmer Kim, Zhenhua Liu, S. Bouras, Kevin Chien, V. Chandrasekhar, P. Chang, Edwin Li, Zhimin Zhao

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引用次数: 78

摘要

随着WLAN、BT和FM在同一移动设备上的出现越来越多，人们需要将这三者放在同一个芯片上，以节省芯片尺寸、I/O数量、BOM和最终成本。常见的块，如晶体振荡器，带隙和电源管理单元可以很容易地共享。本文提出了一种将802.11a/b/g WLAN、单流11n (SSN) WLAN、BT、FM子系统和无线电集成在一个芯片上的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A multistandard, multiband SoC with integrated BT, FM, WLAN radios and integrated power amplifier

The growing occurrences of WLAN, BT, and FM on the same mobile device have created a demand for putting all three on the same die to save on die size, I/O count, BOM, and ultimately cost. Common blocks such as crystal oscillator, bandgap, and power management units can be easily shared. This paper presents a solution in which 802.11a/b/g WLAN, single-stream 11n (SSN) WLAN, BT, and FM subsystem and radio are integrated on a single die.

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2010 IEEE International Solid-State Circuits Conference - (ISSCC)

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