集成滤波性能的5G基站高密度互连微带贴片天线

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems Pub Date : 2018-04-27 DOI:10.3390/TECHNOLOGIES6020045

M. Salucci, C. Castlunger, D. Marcantonio, G. Oliveri, F. Robol, P. Rosatti, L. Tosato, F. Zardi, A. Massa

{"title":"集成滤波性能的5G基站高密度互连微带贴片天线","authors":"M. Salucci, C. Castlunger, D. Marcantonio, G. Oliveri, F. Robol, P. Rosatti, L. Tosato, F. Zardi, A. Massa","doi":"10.3390/TECHNOLOGIES6020045","DOIUrl":null,"url":null,"abstract":"The elementary radiator of a planar array for next generation millimeter-wave (mm-wave) 5G base stations is described. The antenna is designed for high density interconnect (HDI) manufacturing for yielding a compact, densely-interconnected, and highly-integrable stacked structure. The layout of the single element is determined by directly optimizing key radiation features of the whole planar arrangement according to specific application-driven requirements. In addition, thanks to the exploitation of a spline-shaped modelling of the radiator, suitable performance in terms of impedance matching, realized gain, half-power beamwidth (HPBW), polarization purity, and inter-element isolation are achieved within the 28-GHz pass-band. Moreover, integrated out-of-band filtering capabilities are obtained in selected and wide non-contiguous stop-bands without additional circuitry","PeriodicalId":49813,"journal":{"name":"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems","volume":"14 1","pages":"45"},"PeriodicalIF":1.6000,"publicationDate":"2018-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"High Density Interconnect Microstrip Patch Antenna for 5G Base Stations with Integrated Filtering Performance\",\"authors\":\"M. Salucci, C. Castlunger, D. Marcantonio, G. Oliveri, F. Robol, P. Rosatti, L. Tosato, F. Zardi, A. Massa\",\"doi\":\"10.3390/TECHNOLOGIES6020045\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The elementary radiator of a planar array for next generation millimeter-wave (mm-wave) 5G base stations is described. The antenna is designed for high density interconnect (HDI) manufacturing for yielding a compact, densely-interconnected, and highly-integrable stacked structure. The layout of the single element is determined by directly optimizing key radiation features of the whole planar arrangement according to specific application-driven requirements. In addition, thanks to the exploitation of a spline-shaped modelling of the radiator, suitable performance in terms of impedance matching, realized gain, half-power beamwidth (HPBW), polarization purity, and inter-element isolation are achieved within the 28-GHz pass-band. Moreover, integrated out-of-band filtering capabilities are obtained in selected and wide non-contiguous stop-bands without additional circuitry\",\"PeriodicalId\":49813,\"journal\":{\"name\":\"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems\",\"volume\":\"14 1\",\"pages\":\"45\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2018-04-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.3390/TECHNOLOGIES6020045\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/TECHNOLOGIES6020045","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 4

摘要

描述了用于下一代毫米波5G基站的平面阵列的基本辐射体。该天线设计用于高密度互连(HDI)制造，以产生紧凑，密集互连和高度可积的堆叠结构。单个元件的布局是根据特定的应用驱动要求直接优化整个平面布置的关键辐射特征来确定的。此外，由于利用了辐射器的样条形状建模，在28ghz通频带内实现了阻抗匹配、实现增益、半功率波束宽度(HPBW)、极化纯度和元件间隔离等方面的合适性能。此外，在没有额外电路的情况下，在选定的宽非连续阻带中获得了集成的带外滤波能力

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

High Density Interconnect Microstrip Patch Antenna for 5G Base Stations with Integrated Filtering Performance

The elementary radiator of a planar array for next generation millimeter-wave (mm-wave) 5G base stations is described. The antenna is designed for high density interconnect (HDI) manufacturing for yielding a compact, densely-interconnected, and highly-integrable stacked structure. The layout of the single element is determined by directly optimizing key radiation features of the whole planar arrangement according to specific application-driven requirements. In addition, thanks to the exploitation of a spline-shaped modelling of the radiator, suitable performance in terms of impedance matching, realized gain, half-power beamwidth (HPBW), polarization purity, and inter-element isolation are achieved within the 28-GHz pass-band. Moreover, integrated out-of-band filtering capabilities are obtained in selected and wide non-contiguous stop-bands without additional circuitry

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Microsystem Technologies-Micro-And Nanosystems-Information Storage and Processing Systems 工程技术-材料科学：综合

CiteScore

5.20

自引率

9.50%

发文量

147

审稿时长

3.3 months

期刊介绍： "Microsystem Technologies - Micro- and Nanosystems. Information Storage and Processing Systems" is intended to provide rapid publication of important and timely results on electromechanical, materials science, design, and manufacturing issues of these systems and their components. The MEMS/NEMS (Micro/NanoElectroMechanical Systems) area includes sensor, actuators and other micro/nanosystems, and micromechatronic systems integration. Information storage systems include magnetic recording, optical recording, and other recording devices, e.g., rigid disk, flexible disk, tape and card drives. Processing systems include copiers, printers, scanners and digital cameras. All contributions are of international archival quality. These are refereed by MST editors and their reviewers by rigorous journal standards. The journal covers a wide range of interdisciplinary technical areas. It brings together and cross-links the knowledge, experience, and capabilities of academic and industrial specialists in many fields. Finally, it contributes to the economically and ecologically sound production of reliable, high-performance MEMS and information storage & processing systems.