多核处理器中的电压噪声:经验表征和优化机会

Ramon Bertran Monfort, A. Buyuktosunoglu, P. Bose, T. Slegel, G. Salem, S. Carey, R. Rizzolo, T. Strach
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引用次数: 65

摘要

电压噪声特性是优化基于高端处理器系统的出货电压的一个重要方面。电压噪声,即由于电流的瞬态波动而引起的电源电压的变化,如果没有适当地表征,会对设计的稳健性产生负面影响。由于很难非常精确地模拟芯片/系统封装和配电网络(PDN)参数,因此在预硅设置中对电压噪声进行建模和估计通常是不充分的。因此,一个系统的,直接的基于测量的电压噪声特征后硅设置是必要的,以验证设计的稳健性。在本文中,我们提出了一种基于直接测量的最先进的大型机类多核处理器的电压噪声表征。我们开发了一种系统的方法来产生噪声应力标记。我们研究了噪声的敏感性与噪声产生中涉及的不同参数的关系:(a)刺激序列频率,(b)供电电流增量,(c)噪声事件的数量,以及(d)多核环境中事件的对齐或同步程度。通过感知多核芯片中的每核噪声,我们表征了噪声在核心之间的传播。这种见解为通过工作负载映射和动态电压保护带减少噪声开辟了新的机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Voltage Noise in Multi-Core Processors: Empirical Characterization and Optimization Opportunities
Voltage noise characterization is an essential aspect of optimizing the shipped voltage of high-end processor based systems. Voltage noise, i.e. Variations in the supply voltage due to transient fluctuations on current, can negatively affect the robustness of the design if it is not properly characterized. Modeling and estimation of voltage noise in a pre-silicon setting is typically inadequate because it is difficult to model the chip/system packaging and power distribution network (PDN) parameters very precisely. Therefore, a systematic, direct measurement-based characterization of voltage noise in a post-silicon setting is mandatory in validating the robustness of the design. In this paper, we present a direct measurement-based voltage noise characterization of a state-of-the-art mainframe class multicoreprocessor. We develop a systematic methodology to generate noise stress marks. We study the sensitivity of noise in relation to the different parameters involved in noise generation: (a) stimulus sequence frequency, (b) supply current delta, (c) number of noise events and, (d) degree of alignment or synchronization of events in a multi-core context. By sensing per-core noise in a multi-core chip, we characterize the noise propagation across the cores. This insight opens up new opportunities for noise mitigation via workload mappings and dynamic voltage guard banding.
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