三维双目距离传感器的硅衬垫沟槽装配方法

The Japan Society of Applied Physics Pub Date : 2017-09-12 DOI:10.7567/SSDM.2017.PS-5-02

K. Nakajima

{"title":"三维双目距离传感器的硅衬垫沟槽装配方法","authors":"K. Nakajima","doi":"10.7567/SSDM.2017.PS-5-02","DOIUrl":null,"url":null,"abstract":"We devised an alignment method of two image sensors using a Si-interposer with trenches. The trench was formed using deep-reactive ion etching (RIE) equipment. We produced the 3-D range sensor using the method in our experiment and confirmed that sufficient alignment accuracy was realized.","PeriodicalId":22504,"journal":{"name":"The Japan Society of Applied Physics","volume":"82 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2017-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Sensor assembly method using Si-interposer with trenches for 3-D binocular range sensors\",\"authors\":\"K. Nakajima\",\"doi\":\"10.7567/SSDM.2017.PS-5-02\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We devised an alignment method of two image sensors using a Si-interposer with trenches. The trench was formed using deep-reactive ion etching (RIE) equipment. We produced the 3-D range sensor using the method in our experiment and confirmed that sufficient alignment accuracy was realized.\",\"PeriodicalId\":22504,\"journal\":{\"name\":\"The Japan Society of Applied Physics\",\"volume\":\"82 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Japan Society of Applied Physics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.7567/SSDM.2017.PS-5-02\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Japan Society of Applied Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7567/SSDM.2017.PS-5-02","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

我们设计了一种利用带沟槽的硅中间体实现两个图像传感器对准的方法。采用深反应离子蚀刻(RIE)设备形成沟槽。在实验中使用该方法制作了三维测距传感器，并验证了该方法能达到足够的对准精度。

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Sensor assembly method using Si-interposer with trenches for 3-D binocular range sensors

We devised an alignment method of two image sensors using a Si-interposer with trenches. The trench was formed using deep-reactive ion etching (RIE) equipment. We produced the 3-D range sensor using the method in our experiment and confirmed that sufficient alignment accuracy was realized.

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The Japan Society of Applied Physics

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