基于Lamb波的谐振MEMS结构有限元分析

IF 0.6 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Informacije Midem-Journal of Microelectronics Electronic Components and Materials Pub Date : 2020-11-20 DOI:10.33180/infmidem2020.303

P. Marinushkin, A. Levitsky, Fyodor Zograf, V. A. Bakhtina

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引用次数: 1

摘要

本文研究了基于声学兰姆波的超高频MEMS谐振器的建模问题。此外，还分析了决定谐振器工作频率和质量因数能否提高的因素。研究了多种压电材料(AlN、ZnO、GaN)谐振腔激励方式和声波导厚度对Lamb波零模相速度的影响。得到了谐振器机电耦合系数对谐振器几何形状依赖性的估计。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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On the Finite-Element Analysis of Resonance MEMS Structures based on Acoustic Lamb Waves

This paper considers issues of modeling ultra-high frequency MEMS resonators based on acoustic Lamb waves. In addition, the analysis of factors that determine whether it is possible to increase resonators working frequency and quality factor is carried out. Influence of resonator excitation scheme and acoustic waveguide thickness for a range of piezoelectric materials (i.e. AlN, ZnO, GaN) on phase velocity for acoustic Lamb wave zero modes is investigated. As a result, we've got estimations determining dependence of resonators electromechanical coupling coefficient on their geometry.

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来源期刊

Informacije Midem-Journal of Microelectronics Electronic Components and Materials 工程技术-材料科学：综合

CiteScore

1.80

自引率

0.00%

发文量

审稿时长

>12 weeks

期刊介绍： Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material. Topics of interest include: Microelectronics, Semiconductor devices, Nanotechnology, Electronic circuits and devices, Electronic sensors and actuators, Microelectromechanical systems (MEMS), Medical electronics, Bioelectronics, Power electronics, Embedded system electronics, System control electronics, Signal processing, Microwave and millimetre-wave techniques, Wireless and optical communications, Antenna technology, Optoelectronics, Photovoltaics, Ceramic materials for electronic devices, Thick and thin film materials for electronic devices.