离子轰击在直流磁控溅射中的应用

R. Toyoda, S. Miyata, Y. Matsumura, T. Iijima, A. Tonegawa, M. Takeuchi
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引用次数: 0

摘要

在溅射沉积过程中,离子轰击动量强烈依赖于薄膜的内应力,我们已经根据我们之前提出的用于微调机械、光学、电学和磁学性能的新参数pi进行了评估。在本研究中,我们证明了利用Langmuir探针和多栅格分析仪,以施加在基片V sub上的负偏置电压为函数来估计pi,定义为(i / a) P,其中i为离子通量,a为原子通量,P为离子动量。结果发现,除了低于30 V的电压外,pi与V sub大致成正比。这表明,在入射离子能量低于等离子体电位的情况下,等离子体诊断应该测量pi。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of ion bombardment in DC magnetron sputtering DC
Momentum of ion bombardment in sputtering deposition process, which strongly depends on internal stress of thin film, has been evaluated regarding to a new parameter P i we previously proposed for fine-tuning of mechanical, optical, electrical and magnetic properties. In this study, we demonstrate to estimate the P i defined as ( i / a ) p , where i the ion flux, a the atom flux and p the ion’s momentum, by means of Langmuir probe and multi-grid analyzer in a function of negative bias voltage applied on substrates V sub . As a result, it was found that the P i was roughly proportional to V sub except on lower voltage than 30 V. This indicates that the P i should be measured plasma-diagnostically under incident ion energy as low as plasma potential.
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