用于低功耗逻辑的III-N异质结构器件

P. Fay, W. Li, D. Digiovanni, L. Cao, H. Ilatikhameneh, F. Chen, T. Ameen, R. Rahman, Gerhard Klimeck, C. Lund, S. Keller, S. M. Islam, A. Chaney, Y. Cho, D. Jena
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引用次数: 3

摘要

未来几代的超尺度逻辑可能需要替代器件技术来超越Si CMOS的限制;特别是,在大规模、高度集成的系统中,功耗限制使得能够实现比60 mV/ 10更陡的开关斜率(SS)的器件概念特别有吸引力。隧道场效应晶体管(tfet)就是这样一种器件技术的替代品。虽然已经报道了大量基于Si, Ge和窄带隙iii - v的tfet研究,但这些方法都面临着重大挑战。另一种基于III-N宽频带隙半导体与极化工程相结合的方法在漏极电流密度和开关斜率方面具有潜在的优势。在这次演讲中,将讨论基于III-N的逻辑晶体管的前景,包括仿真预测和实验进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
III-N heterostructure devices for low-power logic
Future generations of ultra-scaled logic may require alternative device technologies to transcend the limitations of Si CMOS; in particular, power dissipation constraints in aggressively-scaled, highly-integrated systems make device concepts capable of achieving switching slopes (SS) steeper than 60 mV/decade especially attractive. Tunneling field effect transistors (TFETs) are one such device technology alternative. While a great deal of research into TFETs based on Si, Ge, and narrow band gap III-Vs has been reported, these approaches each face significant challenges. An alternative approach based on the use of III-N wide band gap semiconductors in conjunction with polarization engineering offers potential advantages in terms of drain current density and switching slope. In this talk, the prospects for III-N based TFETs for logic will be discussed, including both simulation projections as well as experimental progress.
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