金属基复合材料的竞争失效机制及其对断裂韧性的影响

Yan Li, Jun Cao, C. Williams
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引用次数: 7

摘要

高性能金属基复合材料的开发需要精心的微观结构设计,以提高材料的断裂韧性,同时保持高强度。显微组织和组分性能共同决定了复合材料在不同变形和破坏机制下的整体断裂韧性。虽然之前的研究已经讨论了关键组织属性对mmc断裂韧性的影响,但它们对塑性变形与裂纹形成相互作用的影响以及它们对竞争破坏机制的影响尚未得到系统的研究。本文提出了一个综合实验和分析框架,通过评估基体、增强颗粒和界面中塑性变形和裂纹表面形成的能量贡献来评估mmc的断裂韧性。采用数字图像相关法,通过位移场测量计算j积分。通过考虑增强体分数、界面特性和基体屈服应力影响的分析模型,量化了不同破坏机制的竞争及其与材料变形的关系。所进行的计算涉及6092Al/SiCp,但总体方法也适用于其他mmc。研究结果表明,界面脱粘是增强复合材料断裂韧性的有效破坏机制。它不仅通过形成弯曲裂纹路径增加表面能量耗散,而且还促进了韧性基体的塑性变形,这在很大程度上有助于mmc的增韧。界面脱键的激活主要取决于SiCp的体积分数、Al的屈服应力和界面键能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Competing Failure Mechanisms in Metal Matrix Composites and Their Effects on Fracture Toughness
Abstract Development of high performance Metal Matrix Composites (MMCs) requires careful microstructure design which can improve material's fracture toughness while maintaining high strength. Microstructure and constituent properties combine to determine the overall fracture toughness of MMCs through the activation of different deformation and failure mechanisms. Although the effects of key microstructural attributes on the fracture toughness of MMCs have been discussed in previous studies, their effects on the interplay between plastic deformation and crack formation, as well as their effects on the competing failure mechanisms have not been systematically studied. In this paper, an integrated experimental and analytical framework is presented to evaluate the fracture toughness of MMCs through an assessment of energy contributions in terms of plastic deformation and crack surface formation in the matrix, reinforcement particles and interface. J-integral is calculated through displacement field measurement using Digital Image Correlation method. The competition of different failure mechanisms and their relations with material deformation are quantified through an analytical model by considering the effects of reinforcement volume fraction, interfacial property and yield stress of the matrix. Calculations carried out concern 6092Al/SiCp, but the overall approach applies to other MMCs as well. Results from this work indicate that interface debonding is a beneficial failure mechanism for fracture toughness enhancement of MMCs. It not only increases the surface energy dissipation by creating tortuous crack paths, but also promotes plastic deformation in the ductile matrix which largely contributes to the toughening of MMCs. The activation of interface debonding primarily depends on the volume fraction of SiCp, the yield stress of Al and the interface bonding energy.
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