方网材料中的拓扑半金属

IF 10.6 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
S. Klemenz, Shiming Lei, L. Schoop
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引用次数: 95

摘要

许多材料结晶时的结构类型以原子的方网为特征。虽然这些化合物可以表现出许多不同的性质,但这个家族的一些成员是拓扑材料。在基于方网的拓扑材料中,观察到的性质是丰富的,例如,从节线半金属到体半整数量子霍尔效应。因此,引导拓扑特性设计的潜力是巨大的。在这里,我们概述了这些相的晶体学和电子特性,并展示了它们是如何联系在一起的,目的是了解哪些方网材料可以是拓扑的,并预测更多的例子。我们通过讨论实验观察到的这个家族的电子性质来结束回顾。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Topological Semimetals in Square-Net Materials
Many materials crystallize in structure types that feature a square net of atoms. While these compounds can exhibit many different properties, some members of this family are topological materials. Within the square-net-based topological materials, the observed properties are rich, ranging, for example, from nodal-line semimetals to a bulk half-integer quantum Hall effect. Hence, the potential for guided design of topological properties is enormous. Here we provide an overview of the crystallographic and electronic properties of these phases and show how they are linked, with the goal of understanding which square-net materials can be topological, and predict additional examples. We close the review by discussing the experimentally observed electronic properties in this family.
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来源期刊
Annual Review of Materials Research
Annual Review of Materials Research 工程技术-材料科学:综合
CiteScore
17.70
自引率
1.00%
发文量
21
期刊介绍: The Annual Review of Materials Research, published since 1971, is a journal that covers significant developments in the field of materials research. It includes original methodologies, materials phenomena, material systems, and special keynote topics. The current volume of the journal has been converted from gated to open access through Annual Reviews' Subscribe to Open program, with all articles published under a CC BY license. The journal defines its scope as encompassing significant developments in materials science, including methodologies for studying materials and materials phenomena. It is indexed and abstracted in various databases, such as Scopus, Science Citation Index Expanded, Civil Engineering Abstracts, INSPEC, and Academic Search, among others.
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