高材料常数玻璃芯片热传感器的设计、制造和电学特性

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1) Pub Date : 2012-03-07 DOI:10.1109/ISPTS.2012.6260925

M. Muralidharan, A. Seema, E. Sunny, K. R. Dayas

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引用次数: 0

摘要

镍锰矿基负温度系数(NTC)热敏电阻组合物作为热传感器广泛应用于各种产品和器件中。采用固态法制备了Ni0.701Mn1.823Cr0.35Fe0.07Si0.056O4 NTC热敏电阻组合物。为获得无缺陷的陶瓷带，优化了铸带浆料组成。通过优化工艺参数，制备了芯片热敏电阻。将所制备的芯片热敏电阻封装在硼硅酸盐玻璃中，形成具有高材料常数和优异可靠性的chip -in- glass热传感器。

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Design, fabrication and electrical characterization of high material constant Chip-in-Glass thermal sensors

Nickel manganite based negative temperature coefficient (NTC) thermistor compositions are extensively used as thermal sensors in a wide range of products and devices. Ni0.701Mn1.823Cr0.35Fe0.07Si0.056O4 NTC thermistor composition was prepared through solid state route. The tape casting slurry composition was optimized to get defect free ceramic tapes. Chip thermistors were prepared from these NTC tapes by optimizing the process parameters. The prepared chip thermistors were encapsulated in borosilicate glass to form Chip-in-Glass thermal sensors with high material constant and excellent reliability.

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2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)

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