用表面光滑的多晶硅薄膜制备微机械器件

H. Guckel, J.J. Sniegowski, T.R. Christenson, S. Mohney, T.F. Kelly
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引用次数: 189

摘要

微机械设备,如轴承,需要光滑的表面。细晶多晶硅的表面粗糙度接近8Årms。将这种类型的薄膜退火到拉伸状态的能力消除了由于压缩屈曲造成的尺寸限制。这些薄膜在微机械装置中的使用受到限制,因为氟化氢蚀刻结构被蚀刻残留物覆盖,导致接触焊接。相对表面之间的接触主要是由表面张力效应引起的。这个问题可以通过移除偏转机构来避免。因此,在牺牲清洗后,水-甲醇漂洗的冷冻几乎消除了表面张力。在0.15毫巴的温度下通过升华很容易除去冰混合物。具有光滑表面和小间隙的独立结构接下来通过硅沉积或其他技术进行钝化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of micromechanical devices from polysilicon films with smooth surfaces

Micromechanical devices such as bearings require smooth surfaces. Fine-grained polysilicon can be produced with a surface roughness near 8Årms. The ability to anneal films of this type into tension eliminates size restrictions due to compressive buckling.

The use of these films in micromechanical devices has been restricted because hydrogen fluoride-etched structures are covered by an etch residue that leads to contact welding. Contact between opposing surfaces is induced mainly by surface tension effects. This problem may be avoided by removing the deflection mechanism. Thus, freezing of a water-methanol rinse after sacrifical ethcing all but eliminates surface tension. Removal of the ice mixture via sublimation at 0.15 millibar occurs readily. Free-standing structures with smooth surfaces and small gaps are next passivated by silicon deposition or other techniques.

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