{"title":"超大规模集成电路设计初期的良率损失预测","authors":"H. Heineken, J. Khare, Wojciech Maly","doi":"10.1109/CICC.1996.510505","DOIUrl":null,"url":null,"abstract":"This paper describes three new yield models. The first takes as input the critical area of a layout; the second approximates the critical area with the minimum spacing area between metal lines; and the third uses transistor density to model critical area. The models were developed and verified using manufacturing data.","PeriodicalId":74515,"journal":{"name":"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference","volume":"8 1","pages":"27-30"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"27","resultStr":"{\"title\":\"Yield loss forecasting in the early phases of the VLSI design process\",\"authors\":\"H. Heineken, J. Khare, Wojciech Maly\",\"doi\":\"10.1109/CICC.1996.510505\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes three new yield models. The first takes as input the critical area of a layout; the second approximates the critical area with the minimum spacing area between metal lines; and the third uses transistor density to model critical area. The models were developed and verified using manufacturing data.\",\"PeriodicalId\":74515,\"journal\":{\"name\":\"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference\",\"volume\":\"8 1\",\"pages\":\"27-30\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"27\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.1996.510505\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1996.510505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Yield loss forecasting in the early phases of the VLSI design process
This paper describes three new yield models. The first takes as input the critical area of a layout; the second approximates the critical area with the minimum spacing area between metal lines; and the third uses transistor density to model critical area. The models were developed and verified using manufacturing data.