超塑性Ti-6Al-4V的固态键合

J. Pilling, D. W. Livesey, J. Hawkyard, N. Ridley
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引用次数: 77

摘要

摘要利用现有的高温空腔生长理论和烧结理论,计算了两层超塑性Ti-6Al-4V之间产生键合所需的时间。将预测的键合条件与实验结果进行了比较,并建立了基于Chen和Argon蠕变空洞生长模型的理论,该理论考虑了材料晶粒尺寸的影响,该尺寸可以比空洞尺寸或原始表面粗糙度小得多。研究发现,在927℃、0.7 - 2mpa (100-300 lb in - 2)的压力下,在0.5 - 4h的时间尺度内,可以形成高完整性的键。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Solid state bonding in superplastic Ti-6Al-4V
AbstractThe time taken to produce a bond between two sheets of superplastic Ti-6Al-4V has been calculated using existing theories of high temperature cavity growth and of sintering. The predicted conditions for bonding have been compared with those determined experimentally, and a theory based on the Chen and Argon model of creep cavity growth has been developed to take into account the effect of a material grain size which can be substantially smaller than either the cavity size or the original surface roughness. It has been found that high integrity bonds can be produced at 927°C with pressures between 0.7 and 2 MPa (100–300 lb in−2), and within a time scale of the order of 0.5–4 h.
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