新型高能物理耐辐射LGAD

J. Segal, C. Kenney, R. Patti, Benjamin Parpillon, Sangki Hong
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引用次数: 0

摘要

近年来,低增益雪崩探测器(LGADs)在高能物理中的应用得到了广泛的研究。它们具有内置增益和快速读出的优点。然而,辐射硬度仍然是一个问题,强子辐照后有效硼掺杂浓度(受体去除)降低,大大降低了lga增益。我们提出了一种新的LGAD工艺流程,该流程允许在增殖区域产生非常陡峭的硼剖面,减少了部分受体去除和由此导致的性能下降。新的LGAD工艺流程需要低温硅硅晶圆键合工艺,该工艺目前正在开发中。利用TCAD过程模拟验证了新结构的可行性,并利用TCAD器件模拟表征了辐照前后LGAD的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New Radiation Tolerant LGAD for High Energy Physics
Low Gain Avalanche Detectors (LGADs) have recently been studied for applications in high energy physics. They provide the advantages of built-in gain and fast read-out. However, radiation hardness remains a problem, reduced effective boron doping concentration (acceptor removal) after hadron irradiation that dramatically reduces LGAD gain. We propose a new LGAD process flow that allows for creation of a very steep boron profile in the multiplication region, reducing the fractional acceptor removal and resulting performance degradation. The new LGAD process flow requires a low temperature silicon-silicon wafer bonding process, which is currently under development. TCAD process simulations are used to demonstrate feasibility of the new structure, and TCAD device simulations are used to characterize LGAD performance before and after irradiation.
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