热膨胀失配和纤维涂层对陶瓷基复合材料纤维/基体界面剪应力的影响

M. Brun, Raj N. Singh
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引用次数: 78

摘要

采用一种改进的压痕技术测量了几种含碳化硅纤维的陶瓷基体的界面剪切应力。结果表明,当基体热膨胀小于纤维热膨胀时,界面应力的摩擦分量基本为零,当基体热膨胀大于纤维热膨胀时,界面应力的摩擦分量随热膨胀失配而线性增加。BN涂层降低了纤维的界面剪应力。在复合材料断裂过程中,较低的基体剪切应力导致了更广泛的纤维拔出。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of thermal expansion mismatch and fiber coating on the fiber/matrix interfacial shear stress in ceramic matrix composites
A modified indentation technique has been used to measure the interfacial shear stress in a number of ceramic matrices containing silicon carbide fibers. It was shown that the frictional component of interfacial stress was essentially zero when matrix thermal expansion was lower than that of the fiber and increased linearly with thermal expansion mismatch when matrix thermal expansion was higher. The interfacial shear stress was lowered when the fibers were coated with BN. Lower matrix shear stresses resulted in a more extensive fiber pullout during the composite fracture.
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