28NM及以上技术节点高效低k介电测试结构及可靠性评估

Zhijuan Wang, Yueqin Zhu, Kai Wang, Yuzhu Gao, W. Chien
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引用次数: 0

摘要

低k/超低k介电材料有望在现代先进集成电路技术节点的制造中大规模实现。基于半导体电学要求,低k介电材料的可靠性性能必须满足给定的目标寿命。本文对可靠性试验结构进行了具体设计。在实际应用方面,我们对测试结构提出了一系列根本性的改进。我们的数据表明,在不改变k值的情况下,通过工艺调整可以进一步优化低k介电体的内在可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Highly effective low-k dielectric test structures and reliability assessment for 28NM technology node and beyond
Low-k/ultra-low-k dielectric is expected to have large-scale implementation in the manufacturing of modern advanced IC technology nodes. The reliability performance of a low-k dielectric must meet the given target lifetime based on semiconductor electrical requirements. Reliability test structures are specifically devised in this paper. We proposed a series of fundamental improvements on test structures in terms of practical applications. Our data shows that intrinsic reliability of the low-k dielectrics can be further optimized through the process tuning without the variation in k value.
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