一个热感知的超标量微处理器

C. Lim, W. R. Daasch, George Z. N. Cai
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引用次数: 71

摘要

提出了一种热感知技术,以减少触发热/功率控制机制时对性能的影响。这种技术被称为热感知微处理器(TAM),它使用芯片上的热传感器来检测微处理器芯片内的热点。在堆芯内部有一个二级管道。它具有架构简单和超低功耗实现。这个二级管道有两个主要功能:1。热减轻;2. 超低功耗实现特定的移动环境(如任何地点,任何时间的电子邮件连接功能)。当温度超过给定的阈值时,核心标量管道进行时钟选通,同时使用二级有序管道。由于二次管道耗电量少得多,其温度也会低得多,因此,当热/电机制触发时,它将为核心管道提供暂时的热释放。这种缓解减少了由于泄漏造成的能量损失,防止过热以提高产品可靠性,并降低了热解决方案的成本。TAM还可以结合其他低功耗技术,如电压缩放,以实现超低功耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A thermal-aware superscalar microprocessor
A thermal-aware technique is proposed to minimize the performance impact when thermal/power control mechanism is triggered. This technique, called thermal-aware microprocessor (TAM), uses on-chip thermal sensors to detect hot-spots within the microprocessor die. There is a secondary pipeline within the core. It is architecturally simple with ultra low power implementation. This secondary pipeline has two main functions: 1. thermal relieve; 2. ultra low power implementation for certain mobile environment (such as any where any time email connect function). When temperature exceeds a given threshold, the core superscalar pipelines are clock-gated while a secondary in-order pipeline is engaged. Since the secondary pipeline consumes much less power, it will have a much lower temperature, and therefore, it will provide a temporary thermal relieve to the core pipelines when the thermal/power mechanism is triggered. This relief reduces energy loss due to leakage, prevents overheating to improve product reliability, and eases cost for thermal solutions. The TAM can also combine with other low power techniques such voltage scaling to achieve ultra low power.
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