{"title":"BCS荧光法检测硫酸铜镀液中Cu (I)的含量","authors":"T. Koga, C. Hirakawa, M. Takeshita, N. Terasaki","doi":"10.7567/SSDM.2017.PS-10-06","DOIUrl":null,"url":null,"abstract":"We successfully detected unstable Cu (I) in copper sulfate plating solution using BCS fluorescence. Quantitative measurement at 10 mol/L or less, out of range with the conventional absorption method, was possible by the fluorescence method. The fluorescent method is promising for Cu (I) analysis in Cu electroplating solution to assure the quality of Cu plating film in higher sensitivity.","PeriodicalId":22504,"journal":{"name":"The Japan Society of Applied Physics","volume":"8 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2017-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Detection of Cu (I) in Copper Sulfate Plating Solution Using BCS Fluorescence\",\"authors\":\"T. Koga, C. Hirakawa, M. Takeshita, N. Terasaki\",\"doi\":\"10.7567/SSDM.2017.PS-10-06\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We successfully detected unstable Cu (I) in copper sulfate plating solution using BCS fluorescence. Quantitative measurement at 10 mol/L or less, out of range with the conventional absorption method, was possible by the fluorescence method. The fluorescent method is promising for Cu (I) analysis in Cu electroplating solution to assure the quality of Cu plating film in higher sensitivity.\",\"PeriodicalId\":22504,\"journal\":{\"name\":\"The Japan Society of Applied Physics\",\"volume\":\"8 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Japan Society of Applied Physics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.7567/SSDM.2017.PS-10-06\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Japan Society of Applied Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7567/SSDM.2017.PS-10-06","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Detection of Cu (I) in Copper Sulfate Plating Solution Using BCS Fluorescence
We successfully detected unstable Cu (I) in copper sulfate plating solution using BCS fluorescence. Quantitative measurement at 10 mol/L or less, out of range with the conventional absorption method, was possible by the fluorescence method. The fluorescent method is promising for Cu (I) analysis in Cu electroplating solution to assure the quality of Cu plating film in higher sensitivity.
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