半导体中的平行传导

Dr Jeffrey R. Lindemuth
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引用次数: 5

摘要

随着多层和多载流子材料的日益普及,半导体材料中的电子输运表征变得越来越困难。例子包括多重掺杂或补偿区域,垂直于传导平面的掺杂不均匀性,表面和界面上的二维载流子,异质结构,多量子阱结构,以及载流子填充不同导带最小值或价带最大值的材料。异质结构可以包含只有几个原子厚的掺杂层,夹在许多其他层之间。了解所有载体的传输特性可以极大地帮助理解新材料和器件,识别加工问题,并通过在制造过程中早期识别好的材料来降低成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Parallel conduction in semiconductors

Electronic transport characterization in semiconductor materials is becoming increasingly difficult as multi-layer and multi-carrier materials become more common. Examples include multiply doped or compensated regions, doping non-uniformities perpendicular to the conduction plane, 2D carriers at surfaces and interfaces, heterostructures, multiple quantum well structures, and materials with carriers populating different conduction band minima or valence band maxima. The heterostructures can contain delta-doped layers only a few atoms thick sandwiched between many other layers. Knowledge of the transport properties of all carriers present can greatly aid understanding of new materials and devices, identifying processing problems, and reducing costs by identifying good material early in the fabrication process.

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