材料萃取及水分对毫米波扇出封装设计的影响研究

Impact Pub Date : 2022-10-26 DOI:10.1109/IMPACT56280.2022.9966697

Chiung-Ying Kuo, H. Kuo, Ming-Fong Jhong, Chen-Chao Wang

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引用次数: 0

摘要

为了保证高频扇出封装设计的性能，特别是在毫米波应用中，衬底介电特性的影响非常严重。聚酰亚胺(PI)材料是扇出封装中常用的材料。PI的水分效应在应力和电性能方面非常明显。因此，本文介绍了介质常数(Dk)和耗散因子(Df)的提取方法。然后研究了湿度对传输线损耗和相位的影响，频率可达毫米波范围。

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A Study of Material Extraction and Moisture Effect on mmWave Fan-out Package Design

In order to ensure the performance of high-frequency fan-out package design, especially at mmWave application, the influence of substrate dielectric characteristic is very serious. Polyimide (PI) material is common material used in Fan-out package. The moisture effect of PI is very obvious in stress and electrical performance. Sso this paper introduces the method of dielectric constant (Dk) and dissipation factor (Df) extraction. And then the moisture effect on transmission line loss and phase are also studied in this paper, the frequency is up to mmWave range.

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