Y. Liu, L. Pu, Y. Yang, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. Tu
{"title":"高熵合金作为极低熔点焊料用于先进的电子封装","authors":"Y. Liu, L. Pu, Y. Yang, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. Tu","doi":"10.1016/j.mtadv.2020.100101","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":8423,"journal":{"name":"arXiv: Applied Physics","volume":"91 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2020-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":"{\"title\":\"A high-entropy alloy as very low melting point solder for advanced electronic packaging\",\"authors\":\"Y. Liu, L. Pu, Y. Yang, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. Tu\",\"doi\":\"10.1016/j.mtadv.2020.100101\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":8423,\"journal\":{\"name\":\"arXiv: Applied Physics\",\"volume\":\"91 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"21\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"arXiv: Applied Physics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1016/j.mtadv.2020.100101\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"arXiv: Applied Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.mtadv.2020.100101","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}