5G毫米波通信系统中单片小型化脊半模波导的微加工

Thomas R. Jones, M. Daneshmand
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引用次数: 4

摘要

在这项工作中,介绍了一种新的毫米波设计平台,利用传统的微加工技术生产全单片小型化3D脊半模波导。与之前报道的晶圆级波导相比,这些结构提供了大量的模具空间减少,同时也提供了提高集成和制造良率的机会。概述了微加工工艺流程,并测量了制造的原型。设计并制作了一种截止频率为58 GHz的脊状半模波导,工作在e波段。测量结果表明,衰减损耗低至0.3 dB/mm,同时比先前报道的标准矩形单片3D波导小型化63%。独立于载波衬底性能,所提出的充气单片脊状半模波导显示出提供适用于毫米波通信的增强集成技术的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Microfabrication of Monolithic Miniaturized Ridged Half-Mode Waveguides for 5G Millimeter-Wave Communication Systems
Within this work, a novel millimeter-wave design platform is introduced, utilizing conventional microfabrication techniques to produce fully monolithic miniaturized 3D ridged half-mode waveguides. These structures offer substantial die real estate reduction compared to previously reported wafer-level waveguides, while also offering the opportunity for improvements in integration and fabrication yield. The microfabrication process flow is outlined, and a fabricated prototype is measured. A ridged half-mode waveguide is designed and fabricated with cutoff frequency of 58 GHz, for operation within E-band. The measured results show attenuation loss as low as 0.3 dB/mm, while achieving 63% miniaturization over standard rectangular monolithic 3D waveguide previously reported. Independent from the carrier substrate performance, the proposed air-filled monolithic ridged half-mode waveguide demonstrates potential to provide enhanced integration technology suitable for millimeter-wave communication.
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