{"title":"77GHz汽车雷达发射机芯片的热电仿真","authors":"A. Augustin, T. Hauck, A. Ghazinour","doi":"10.1109/ESIME.2006.1643998","DOIUrl":null,"url":null,"abstract":"The paper presents the thermal design process of a transmitter chip by means of analytical solutions and numerical simulation. Thermo-electrical models representing the heat transfer mechanisms were developed. Parametric simulation studies have been applied for the device optimization. Special emphasis was put onto the multi-scale problem that appears with very small heat sources and dimensions in the square-micrometer range respectively. Submodeling technique is used to manage associated numerical difficulties. A parametric model is generated for a transmitter module with multiple transistor blocks on single chip. The model is validated by analytical solutions for heat sources on finite regions and associated experimental temperature measurements on wafer. Solutions and results of the parametric design studies are presented","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"19 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Thermo-Electric Simulation of a 77GHz Radar Transmitter Chip for Automotive Applications\",\"authors\":\"A. Augustin, T. Hauck, A. Ghazinour\",\"doi\":\"10.1109/ESIME.2006.1643998\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents the thermal design process of a transmitter chip by means of analytical solutions and numerical simulation. Thermo-electrical models representing the heat transfer mechanisms were developed. Parametric simulation studies have been applied for the device optimization. Special emphasis was put onto the multi-scale problem that appears with very small heat sources and dimensions in the square-micrometer range respectively. Submodeling technique is used to manage associated numerical difficulties. A parametric model is generated for a transmitter module with multiple transistor blocks on single chip. The model is validated by analytical solutions for heat sources on finite regions and associated experimental temperature measurements on wafer. Solutions and results of the parametric design studies are presented\",\"PeriodicalId\":60796,\"journal\":{\"name\":\"微纳电子与智能制造\",\"volume\":\"19 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-04-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"微纳电子与智能制造\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2006.1643998\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1643998","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermo-Electric Simulation of a 77GHz Radar Transmitter Chip for Automotive Applications
The paper presents the thermal design process of a transmitter chip by means of analytical solutions and numerical simulation. Thermo-electrical models representing the heat transfer mechanisms were developed. Parametric simulation studies have been applied for the device optimization. Special emphasis was put onto the multi-scale problem that appears with very small heat sources and dimensions in the square-micrometer range respectively. Submodeling technique is used to manage associated numerical difficulties. A parametric model is generated for a transmitter module with multiple transistor blocks on single chip. The model is validated by analytical solutions for heat sources on finite regions and associated experimental temperature measurements on wafer. Solutions and results of the parametric design studies are presented
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
