不同拓扑结构的SRAM性能评估及180nm工艺下SRAM存储阵列设计

Rudresh T. K., M. S. H., Sonu S Y
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引用次数: 0

摘要

存储电路,如静态随机存取存储器(SRAM)和动态随机存取存储器(DRAM)是系统设计的一个组成部分,对系统级功耗有很大贡献。由于电池供电设备的爆炸式增长和电路集成度的提高,存储器的工作速度和功耗已成为重要的参数,因此,通过使用万能工具cadence virtuoso在180nm技术上进行模拟,研究了具有不同拓扑结构的sram的传播延迟、静态噪声裕度(SNM)、角分析和静态功耗等参数。此外,还从2×2、4×4到8×8对SRAM存储阵列的拓扑性能进行了比较,从而验证了SRAM的读写操作方式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance Evaluation of Different Topologies of SRAM and SRAM Memory Array Design at 180nm Technology
Memory circuits such as static random-access memory (SRAM) and dynamic random-access memory (DRAM) form an integral part of system design and contribute significantly to system-level power consumption. Memory operating speeds and power dissipation have become important parameters due to the explosive growth of battery-operated appliances and the increased integration of circuits Hence SRAMs with different topologies are examined in terms of parameters like propagation delay, Static Noise Margin (SNM), corner analysis, and static power dissipation by simulating using versatile tool cadence virtuoso at 180nm technology. Besides, topological performance comparison, the SRAM memory array has also been illustrated from 2×2, 4×4 to 8×8, thereby verifying the read and write modes of operation of SRAM.
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