近红外、紫外和激光辐照作为印刷电子器件替代光子烧结方法的鉴定

S. Neermann, M. Steindl, J. Franke, Edgar Mayer, Michael Schmidt
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引用次数: 4

摘要

印刷电子学以一种新的制造电子产品的方式创造了新的应用领域。由于其技术和3D设计的自由,新的市场和创新的产品出现,最初是不可想象的。然而,目前研究的重点是掌握和改进印刷工艺。为了在最短的时间内获得高导电性,随后的干燥和致密化印刷结构的工艺步骤到目前为止几乎没有考虑过。本文探讨了印刷电子中有前途的光子烧结方法的拟合和优化参数,并将其与在炉中进行更耗时的烧结工艺进行了比较。这些光子烧结方法包括近红外、紫外光以及激光对印刷结构的照射。光子烧结由于直接和选择性地将能量应用于印刷结构而不会损坏对温度敏感的基材,因此有望更快,更有效地固化和烧结。基片材料采用ABS和PC-ABS,以及玻璃材料。这两种聚合物材料都是标准的和技术热塑性塑料,在市场上大量低价供应。为了制造印刷电路,为了加工低成本的银基微颗粒浆料,使用了点胶打印机。根据印刷导体路径的电导率和与衬底的粘附强度对烧结效果进行了评价。此外,还考虑了结构固化所需的烧结时间以及光子处理对衬底或印刷轨迹的影响。为了进行实验,设置了两种不同的打印布局,以便能够评估第一种布局上的电学性能和第二种布局上的附着力。为了对光子烧结方法进行详细的探索,进行了全因子设计方案。近红外辐照的重要参数是辐照时间和辐照功率。在紫外光烧结时,参数为辐照时间、样品表面与紫外发射器的距离。在激光辐射治疗中,确定了激光功率和运动速度为相关参数。为了能够与主要使用的烧结方法进行比较,样品也在炉中进行了烧结。结果表明,烧结时间显著减少到几秒钟,具有相当甚至明显更好的电气和机械性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Qualification of NIR, UV and Laser Irradiation as Alternative Photonic Sintering Methods for Printed Electronics
Printed Electronics creates new areas of applications with a new manner of manufacturing electronics. Due to its technical and 3D design freedom, new markets and innovative products arise that were initially unthinkable. However, the focus of research is currently on mastering and improving the printing process. The subsequent process step of drying and densifying the printed structures to achieve high conductivities in the shortest possible time is up to now hardly considered. This paper treats the inquiry of fitted and optimized parameters of alternative promising photonic sintering methods for printed electronics compared to the much more time-intensive state of the art sintering process in a furnace. These photonic sintering methods comprise the near infrared, ultraviolet light as well as laser irradiation of the printed structures. Photonic sintering promises faster and more efficient curing and sintering due to the direct and selective application of energy to the printing structures without damaging the temperature-sensitive substrates. As substrate materials ABS and PC-ABS, as well as a glass material were used. Both polymer materials are standard and technical thermoplastics which are available at the market in huge quantities at low price. For the manufacture of printed circuits, a dispense printer was used, in order to process a low-cost silver-based micro particle paste. The evaluation of the sintering result was carried out based on the electrical conductivity of the printed conductor path and the adhesion strength on the substrate. In addition, the sintering time required for the curing of the structures as well as impacts on the substrate or the printed tracks due to photonic treatment were taken into account. To perform the experiments, two different print layouts were set up in order to be able to assess the electrical properties on the first layout and the adhesion on the second layout. To obtain a detailed statement on the exploration on the photonic sintering methods, a fully factorial design plan was conducted. For the near-infrared irradiation, the important parameters were the irradiation duration and the irradiation power. While sintered by ultraviolet light, the parameters were irradiation time, as well as the distance between the sample surface and the UV emitter. In the treatment by means of laser radiation, laser power and the motion speed were identified as the relevant parameters. In order to be able to draw a comparison to the mainly used sintering method, samples were also sintered in a furnace. The results show a significant reduction of the sintering time to a few seconds with comparable and even significantly better electrical and mechanical properties.
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