1.3 μ m InGaAsP脊波导激光器在砷化镓和硅衬底上的薄膜转移

C. Shieh, J. Chi, C. Armiento, P. Haugsjaa, A. Negri, M. Rothman, W.I. Wang
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引用次数: 1

摘要

讨论了一种将半导体外延薄膜从晶格匹配生长衬底转移到不同材料的主衬底的技术。外延薄膜的转移允许具有不同晶格常数的材料粘合在一起,而不会在对器件操作至关重要的区域产生大量缺陷。薄膜转移工艺利用金属焊料作为转移的半导体层和主衬底之间的界面。在这个转移过程中。在转移过程中,薄膜在任何时候都是刚性支撑的,提供了无缺陷大面积薄膜的潜力。介绍了在GaAs和Si衬底上制备InGaAsP激光器的方法。对激光器光学特性的测量显示,阈值电流与传统激光器相当
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 1.3 mu m InGaAsP ridge waveguide laser on GaAs and silicon substrates thin-film transfer
A technique that makes it possible to transfer semiconductor epitaxial films from a lattice-matched growth substrate to a host substrate of a different material is discussed. The transfer of epitaxial films allows materials with different lattice constants to be bonded together without generating a substantial number of defects in regions that are critical to device operation. The thin-film transfer process utilizes metallic solder as an interface between the transferred semiconductor layers and the host substrate. In this transfer process. the film is rigidly supported at all times during transfer, providing the potential for defect-free large-area films. The fabrication of InGaAsP lasers on both GaAs and Si substrates is described. Measurements of the optical characteristics of the lasers show threshold currents comparable to those of conventional lasers.<>
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