{"title":"激光重熔Al-Cu共晶合金的快速凝固","authors":"M. Zimmermann , M. Carrard , W. Kurz","doi":"10.1016/0001-6160(89)90203-4","DOIUrl":null,"url":null,"abstract":"<div><p>Rapid surface resolidification using a high powered CO<sub>2</sub>-laser has been performed on eutectic Al-32.7 wt% Cu at speeds between 0.2 and 8 m/s. By means of longitudinal cuts through the centre of the laser trace, the local growth rate has been measured by observation of the orientation of the microstructure using transmission electron microscopy. The various microstructures as a function of growth rate, are: </p><ul><li><span>1.</span><span><p>(a) regular lamellar eutectic α-Al/θ-Al<sub>2</sub>Cu structure for growth rates below 20 cm/s with interlamellar spacing as fine as 17 nm;</p></span></li><li><span>2.</span><span><p>(b) a new wavy eutectic α-Al/θ'-Al<sub>2</sub>Cu morphology for growth rates of between 20 and 50 cm/s;</p></span></li><li><span>3.</span><span><p>(c) a banded structure formed by alternating supersaturated α-Al solid solution and the wavy eutectic for growth rates greater than 50 cm/s.</p></span></li></ul> A recent analytical model for eutectic growth under rapid solidification condition is compared to the experimental results. Contrary to the classical <em>λ</em><sup>2</sup><em>V</em><sub><em>s</em></sub> = const. relationship, which predicts a continuous decrease in spacing as the growth rate increases, this new theoretical model clearly predicts a limit for the coupled eutectic growth which finds its analogy in single phase solidification in the limit of absolute stability.</div>","PeriodicalId":6969,"journal":{"name":"Acta Metallurgica","volume":"37 12","pages":"Pages 3305-3313"},"PeriodicalIF":0.0000,"publicationDate":"1989-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0001-6160(89)90203-4","citationCount":"187","resultStr":"{\"title\":\"Rapid solidification of Al-Cu eutectic alloy by laser remelting\",\"authors\":\"M. Zimmermann , M. Carrard , W. Kurz\",\"doi\":\"10.1016/0001-6160(89)90203-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Rapid surface resolidification using a high powered CO<sub>2</sub>-laser has been performed on eutectic Al-32.7 wt% Cu at speeds between 0.2 and 8 m/s. By means of longitudinal cuts through the centre of the laser trace, the local growth rate has been measured by observation of the orientation of the microstructure using transmission electron microscopy. The various microstructures as a function of growth rate, are: </p><ul><li><span>1.</span><span><p>(a) regular lamellar eutectic α-Al/θ-Al<sub>2</sub>Cu structure for growth rates below 20 cm/s with interlamellar spacing as fine as 17 nm;</p></span></li><li><span>2.</span><span><p>(b) a new wavy eutectic α-Al/θ'-Al<sub>2</sub>Cu morphology for growth rates of between 20 and 50 cm/s;</p></span></li><li><span>3.</span><span><p>(c) a banded structure formed by alternating supersaturated α-Al solid solution and the wavy eutectic for growth rates greater than 50 cm/s.</p></span></li></ul> A recent analytical model for eutectic growth under rapid solidification condition is compared to the experimental results. Contrary to the classical <em>λ</em><sup>2</sup><em>V</em><sub><em>s</em></sub> = const. relationship, which predicts a continuous decrease in spacing as the growth rate increases, this new theoretical model clearly predicts a limit for the coupled eutectic growth which finds its analogy in single phase solidification in the limit of absolute stability.</div>\",\"PeriodicalId\":6969,\"journal\":{\"name\":\"Acta Metallurgica\",\"volume\":\"37 12\",\"pages\":\"Pages 3305-3313\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/0001-6160(89)90203-4\",\"citationCount\":\"187\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Acta Metallurgica\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/0001616089902034\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Metallurgica","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0001616089902034","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Rapid solidification of Al-Cu eutectic alloy by laser remelting
Rapid surface resolidification using a high powered CO2-laser has been performed on eutectic Al-32.7 wt% Cu at speeds between 0.2 and 8 m/s. By means of longitudinal cuts through the centre of the laser trace, the local growth rate has been measured by observation of the orientation of the microstructure using transmission electron microscopy. The various microstructures as a function of growth rate, are:
1.
(a) regular lamellar eutectic α-Al/θ-Al2Cu structure for growth rates below 20 cm/s with interlamellar spacing as fine as 17 nm;
2.
(b) a new wavy eutectic α-Al/θ'-Al2Cu morphology for growth rates of between 20 and 50 cm/s;
3.
(c) a banded structure formed by alternating supersaturated α-Al solid solution and the wavy eutectic for growth rates greater than 50 cm/s.
A recent analytical model for eutectic growth under rapid solidification condition is compared to the experimental results. Contrary to the classical λ2Vs = const. relationship, which predicts a continuous decrease in spacing as the growth rate increases, this new theoretical model clearly predicts a limit for the coupled eutectic growth which finds its analogy in single phase solidification in the limit of absolute stability.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
