低晶格错配外延结构的缺陷产生

A. Maros, N. Faleev, C. Honsberg
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引用次数: 1

摘要

研究了分子束外延生长在(001)GaAs晶片上的InGaAs和GaAsSb材料体系中晶体缺陷的形成与外延层厚度的关系。两组样品中Sb和In的含量约为8%,InGaAs结构的标称厚度分别为50、125、250nm和500nm, GaAsSb结构的标称厚度分别为100、250和500nm。高分辨率x射线衍射结果表明,两种体系在几乎相同的厚度下获得了相似的部分弛豫。揭示了与三元层厚度相关的点缺陷向位错环的一致结构转变。在250 nm厚的GaAsSb和InGaAs层中,由于60°位错环的密度为~ 1 × 109 cm-2,导致部分弛豫分别为42%和46%。在500nm厚的InGaAs薄膜中,弛豫率增加到64%,而在500nm厚的GaAsSb薄膜中,弛豫率增加到68%,尽管由于这些位错环的交叉,体积中60°位错环的密度降低了。对揭示的构造特征提出了解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Defect creation in low lattice-mismatched epitaxial structures
The formation of crystalline defects is studied as a function of the epitaxial layer thickness in InGaAs and GaAsSb material systems grown by molecular beam epitaxy on (001) GaAs wafers. The Sb and In composition is roughly 8% in both sets of samples while the nominal thicknesses are respectively 50, 125, 250nm and 500nm for the InGaAs structures and 100, 250 and 500nm for the GaAsSb structures. High-resolution x-ray diffraction results show that similar partial relaxation is obtained in both systems for nearly the same thickness. Consistent structural transformation of point defects into dislocation loops related to the thickness of ternary layers is revealed. This resulted in a partial relaxation of 42 and 46% in the 250 nm thick GaAsSb and InGaAs layers respectively due to a density of secondary 60° dislocation loops of ~ 1 × 109 cm-2. The relaxation increased to 64% in the 500nm thick InGaAs and to 68% for the 500nm thick GaAsSb films even though the density of 60° dislocation loops in the volume was reduced due to intersections of these dislocation loops. Explanation of revealed structural features is suggested.
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