半导体聚合物的热电性质

IF 10.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Annual Review of Materials Research Pub Date : 2020-07-01 DOI:10.1146/annurev-matsci-082219-024716

K. Peterson, E. M. Thomas, M. Chabinyc

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引用次数: 20

摘要

半导体聚合物有潜力用于轻量化、柔性和采用溶液加工制造的热电器件。由于这些聚合物结构和能量的无序性，它们的结构和热电性能之间的关系是复杂的。我们回顾了相关的工艺路线和掺杂方法对聚合物热电性能的影响。这里强调的研究已经导致热功率和电导率之间的相关性，可以用正在研究的理论来描述。随着对其性能背后的材料特性的深入了解，半导体聚合物可以用于未来的发电或冷却设备。

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Thermoelectric Properties of Semiconducting Polymers

Semiconducting polymers have the potential to be used in thermoelectric devices that are lightweight, flexible, and fabricated using solution processing. Because of the structural and energetic disorder of these polymers, the relationship between their structure and thermoelectric properties is complex. We review how interrelated processing routes and doping methods affect the thermoelectric properties of polymers. The studies highlighted here have led to correlations between thermopower and electrical conductivity that can be described by theories under investigation. With greater understanding of the materials properties behind their performance, semiconducting polymers can be used in future power generation or cooling devices.

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来源期刊

Annual Review of Materials Research 工程技术-材料科学：综合

CiteScore

17.70

自引率

1.00%

发文量

期刊介绍： The Annual Review of Materials Research, published since 1971, is a journal that covers significant developments in the field of materials research. It includes original methodologies, materials phenomena, material systems, and special keynote topics. The current volume of the journal has been converted from gated to open access through Annual Reviews' Subscribe to Open program, with all articles published under a CC BY license. The journal defines its scope as encompassing significant developments in materials science, including methodologies for studying materials and materials phenomena. It is indexed and abstracted in various databases, such as Scopus, Science Citation Index Expanded, Civil Engineering Abstracts, INSPEC, and Academic Search, among others.