同时喷射沉积和强化金属(SSP)

A. Singer
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引用次数: 6

摘要

摘要介绍了一种新的工艺——同步喷丸强化(SSP),它包括金属的喷射沉积和同步喷丸强化。这种组合的增量操作允许在黑色或有色金属中形成厚或薄的矿床。在此过程中,沉积层经过热加工和致密处理,与传统的喷涂沉积层相比,其性能得到了改善。另一个优点是喷射沉积的固有残余拉伸应力被喷丸引起的压应力抵消。通过控制同时喷丸操作,表明SSP沉积层的残余应力可以保持在任何要求的正或负水平。给出了气体雾化熔体、电弧喷涂和等离子喷涂制备SSP产品的实例和结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simultaneous spray deposition and peening of metals (SSP)
AbstractA new process, simultaneous spray peening (SSP), is described which comprises the spray deposition of metals together with simultaneous shot peening. This combined incremental operation allows either thick or thin deposits to be made in ferrous or non-ferrous metals. The deposits are hot worked and densified during the process so improving their properties compared with more conventional spray deposits. An additional advantage is that the inherent residual tensile stresses of spray deposition are counter-balanced by the compressive stresses caused by peening. By control of the simultaneous peening operation it is shown that the residual stresses in SSP deposits can be maintained at any required positive or negative level. Examples and structures are shown of SSP products made from gas-atomized melts, by arc spray, and by plasma spray.
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