基于热电堆的SOI CMOS热壁剪切应力传感器的三维建模

2014 International Semiconductor Conference (CAS) Pub Date : 2014-12-01 DOI:10.1109/SMICND.2014.6966459

C. Falco, A. De Luca, S. Sarfraz, I. Haneef, J. Coull, S. Z. Ali, F. Udrea

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引用次数: 0

摘要

本文介绍了利用Comsol Multiphysics软件获得的SOI CMOS MEMS热壁剪应力传感器的多物理场三维模型。它包括所有涉及的物理领域及其相互作用。简要介绍了该装置，并说明了其工作原理。然后描述了数值模型和验证过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D modelling of a thermopile-based SOI CMOS thermal wall shear stress sensor

This paper presents a multiphysic 3-D model of an SOI CMOS MEMS thermal wall shear stress sensor obtained using “Comsol Multiphysics”. It includes all the physical domains involved and their interaction. After a brief introduction, the device is presented and its working principle explained. The numerical model and the validation process are then described.

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2014 International Semiconductor Conference (CAS)

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