MOSFET IDVG曲线双驼峰效应研究

Jun Hu, Zhaozhao Xu, Wenting Duan, Ziquan Fang, Donghua Liu, W. Qian
{"title":"MOSFET IDVG曲线双驼峰效应研究","authors":"Jun Hu, Zhaozhao Xu, Wenting Duan, Ziquan Fang, Donghua Liu, W. Qian","doi":"10.1109/CSTIC49141.2020.9282418","DOIUrl":null,"url":null,"abstract":"In the traditional CMOS manufacturing process, we often use the IV curve to evaluate the characteristics of the transistor, and sometimes the IdVg curves of the transistor will appear double hump, especially for the NMOS. This paper analyzes mechanism of the double hump phenomenon of the IdVg curve. There are two main causes, one is due to the segregation effect of impurities, and the other is due to the manufacturing process of STI. This article also shares ways to improve this phenomenon.","PeriodicalId":6848,"journal":{"name":"2020 China Semiconductor Technology International Conference (CSTIC)","volume":"35 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study of MOSFET IDVG Curve Double Hump Effect\",\"authors\":\"Jun Hu, Zhaozhao Xu, Wenting Duan, Ziquan Fang, Donghua Liu, W. Qian\",\"doi\":\"10.1109/CSTIC49141.2020.9282418\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the traditional CMOS manufacturing process, we often use the IV curve to evaluate the characteristics of the transistor, and sometimes the IdVg curves of the transistor will appear double hump, especially for the NMOS. This paper analyzes mechanism of the double hump phenomenon of the IdVg curve. There are two main causes, one is due to the segregation effect of impurities, and the other is due to the manufacturing process of STI. This article also shares ways to improve this phenomenon.\",\"PeriodicalId\":6848,\"journal\":{\"name\":\"2020 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"35 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC49141.2020.9282418\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC49141.2020.9282418","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在传统的CMOS制造工艺中,我们经常使用IV曲线来评价晶体管的特性,有时晶体管的IdVg曲线会出现双驼峰,特别是对于NMOS。本文分析了IdVg曲线双峰现象的机理。主要有两个原因,一是由于杂质的偏析作用,二是由于STI的制造工艺。本文还分享了改善这一现象的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study of MOSFET IDVG Curve Double Hump Effect
In the traditional CMOS manufacturing process, we often use the IV curve to evaluate the characteristics of the transistor, and sometimes the IdVg curves of the transistor will appear double hump, especially for the NMOS. This paper analyzes mechanism of the double hump phenomenon of the IdVg curve. There are two main causes, one is due to the segregation effect of impurities, and the other is due to the manufacturing process of STI. This article also shares ways to improve this phenomenon.
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