Evaluation and Extraction of Equivalent Circuit Parameters for GSG-Type Bonding Wires Using Electromagnetic Simulator

SUMMARY In this paper, the author performed an electromagnetic field simulation of a typical bonding wire structure that connects a chip and a package, and evaluated the signal transmission characteristics (S- parameters). In addition, the inductance per unit length was extracted by comparing with the equivalent circuit of the distributed constant line. It turns out that the distributed constant line model is not su ffi cient because there are frequencies where chip-package resonance occurs. Below the res- onance frequency, the conventional low-frequency approximation model was e ff ective, and it was found that the inductance was about 1nH / mm.