低温工艺制备的低温多晶硅薄膜晶体管电特性研究

IF 1.3 Q3 COMPUTER SCIENCE, INFORMATION SYSTEMS
Chia-Chuan Wu, William Cheng-Yu Ma, Yu‐Xuan Wang, Mao‐Chou Tai, Yu-An Chen, Hong-Yi Tu, Sheng-Yao Chou, Ya-Ting Chien, T. Chang
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引用次数: 0

摘要

研究了低温工艺制备的低温多晶硅薄膜晶体管(LTPS TFTs)的电学特性。为了改进AMOLED显示器的工艺,需要采用和研究较低的制造温度,因为较低的制造温度适合柔性电子器件。一般来说,LTPS TFTs的制造温度约为$400 ^{\circ}\ mathm {C}$。因此,为了明确较低的制造温度的影响,分别选择$400 ^{\circ}\mathrm{C}$、$370 ^{\circ}\mathrm{C}$和$350 ^{\circ}\mathrm{C}$作为三个TFT样品在器件制造过程中的最高加工温度。研究发现,较低的制造温度器件具有较低的导通电流和较高的导通电阻。然而,由于阱辅助热场发射,当工艺温度下降时,观察到较低的关闭状态泄漏电流。讨论了Silvaco TCAD模拟来支持我们的发现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of Electrical Characteristics in Low-Temperature Polycrystalline Silicon Thin-Film Transistors Fabricated at Low-Temperature Process
In this work, the electrical characteristics of the low-temperature polysilicon thin-film transistors (LTPS TFTs) fabricated at low-temperature process were investigated. To improve the process of AMOLED displays, a lower fabrication temperature is necessary to adopt and investigate since a lower fabrication temperature is suitable for flexible electronics. In general, the fabrication temperature of LTPS TFTs is about $400 ^{\circ}\mathrm{C}$. Therefore, to clarify the impact of lower fabrication temperature, $400 ^{\circ}\mathrm{C}$, $370 ^{\circ}\mathrm{C}$, and $350 ^{\circ}\mathrm{C}$ are chosen as the maximum processing temperature during device fabrication for three TFT samples, respectively. It is found that the lower fabrication temperature device has lower on-current and higher on-resistance. However, a lower off-state leakage current is observed while the process temperature is declining due to trap-assisted thermal field emission. Silvaco TCAD simulation is discussed to support our findings.
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来源期刊
IET Networks
IET Networks COMPUTER SCIENCE, INFORMATION SYSTEMS-
CiteScore
5.00
自引率
0.00%
发文量
41
审稿时长
33 weeks
期刊介绍: IET Networks covers the fundamental developments and advancing methodologies to achieve higher performance, optimized and dependable future networks. IET Networks is particularly interested in new ideas and superior solutions to the known and arising technological development bottlenecks at all levels of networking such as topologies, protocols, routing, relaying and resource-allocation for more efficient and more reliable provision of network services. Topics include, but are not limited to: Network Architecture, Design and Planning, Network Protocol, Software, Analysis, Simulation and Experiment, Network Technologies, Applications and Services, Network Security, Operation and Management.
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