用于3dic互连的独立内置自检/修复收发器

2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) Pub Date : 2016-10-01 DOI:10.1109/APCCAS.2016.7804061

M. Aung, T. T. Kim

{"title":"用于3dic互连的独立内置自检/修复收发器","authors":"M. Aung, T. T. Kim","doi":"10.1109/APCCAS.2016.7804061","DOIUrl":null,"url":null,"abstract":"In this paper, we propose self-contained built-in-self-test/repair (BIST/R) solutions to improve the reliability of the direct face-to-face copper thermo-compression bonding A dual-mode transceiver is presented to operate either as an ohmic mode when the bonding has low resistance or as a capacitive coupling mode when the bonding is faulty showing high resistance.","PeriodicalId":6495,"journal":{"name":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Self-contained built-in-self-test/repair transceivers for interconnects in 3DICs\",\"authors\":\"M. Aung, T. T. Kim\",\"doi\":\"10.1109/APCCAS.2016.7804061\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we propose self-contained built-in-self-test/repair (BIST/R) solutions to improve the reliability of the direct face-to-face copper thermo-compression bonding A dual-mode transceiver is presented to operate either as an ohmic mode when the bonding has low resistance or as a capacitive coupling mode when the bonding is faulty showing high resistance.\",\"PeriodicalId\":6495,\"journal\":{\"name\":\"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APCCAS.2016.7804061\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCCAS.2016.7804061","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在本文中，我们提出了自包含的内置自检/修复(BIST/R)解决方案，以提高直接面向铜热压缩键合的可靠性。提出了双模收发器，当键合具有低电阻时作为欧姆模式工作，当键合故障时作为电容耦合模式工作，显示高电阻。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Self-contained built-in-self-test/repair transceivers for interconnects in 3DICs

In this paper, we propose self-contained built-in-self-test/repair (BIST/R) solutions to improve the reliability of the direct face-to-face copper thermo-compression bonding A dual-mode transceiver is presented to operate either as an ohmic mode when the bonding has low resistance or as a capacitive coupling mode when the bonding is faulty showing high resistance.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)

自引率

0.00%

发文量