500nm InP DHBT技术的175 GHz带宽高线性度分布式放大器

T. Shivan, Maruf Hossain, R. Doerner, S. Schulz, T. Johansen, S. Boppel, W. Heinrich, V. Krozer
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引用次数: 12

摘要

本文报道了一种采用500nm转移衬底InP DHBT技术的高线性高效超宽带分布式放大器。五个单元单元各有一个三码晶体管集提供超宽带性能的放大器。采用500 nm的晶体管节点,ft和fmax分别为350 GHz和490 GHz。测量结果显示,小信号增益为12 dB,近直流带宽为3 dB,至175 GHz。对于大信号操作,该电路在150 GHz时达到8.4 dBm的1db输出压缩点P1dB,饱和输出功率约为10 dBm,相关的最大PAE为6%。这是DAs在该频率下的最佳线性度以及最高饱和输出功率和PAE。电路仅消耗180mw直流功率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 175 GHz Bandwidth High Linearity Distributed Amplifier in 500 nm InP DHBT Technology
This work reports a highly linear and efficient ultra-wideband distributed amplifier in 500 nm transferred-substrate InP DHBT technology. Five unit cells each with a tri-code transistor set provide the ultra-wideband properties of this amplifier. A transistor node of 500 nm is used which has an ft and fmax of 350 and 490 GHz respectively. The measurements show a small-signal gain of 12 dB with a 3-dB bandwidth of near-DC to 175 GHz. For large signal operation, the circuit reaches a 1-dB output compression point, P1dB, of 8.4 dBm at 150 GHz, a saturated output power of approximately 10 dBm, and an associated maximum PAE of 6 %. This is the best linearity as well as the highest saturated output power and PAE reported at this frequency for DAs. The circuit consumes 180 mW DC power only.
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