下一个纳米电子时代合适的eDRAM配置综述

E. Amat, R. Canal, A. Calomarde, A. Rubio
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引用次数: 0

摘要

我们总结了我们的大部分研究集中在主要的可靠性问题上,这些问题可能会威胁到增益细胞的eDRAM行为,当它在纳米器件范围内进行模拟时。因此,为了超越同类的存储单元,我们探索了不同的技术方案和操作机制。当3T1D-eDRAM单元基于FinFET器件时,可以观察到最佳的存储单元性能。对于sub-22nm技术节点的存储单元,器件可变性和SEU都是关键的可靠性问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Review on suitable eDRAM configurations for next nano-metric electronics era
We summarize most of our studies focused on the main reliability issues that can threat the gain-cells eDRAM behavior when it is simulated at the nano-metric device range has been collected in this review. So, to outperform their memory cell counterparts, we explored different technological proposals and operational regimes where it can be located. The best memory cell performance is observed for the 3T1D-eDRAM cell when it is based on FinFET devices. Both device variability and SEU appear as key reliability issues for memory cells at sub-22nm technology node.
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