氧等离子体处理提高烷基端自组装单层栅极电介质的润湿性

K. Kuribara
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引用次数: 0

摘要

采用氧等离子体处理技术改善了烷基自组装单层膜(SAM)的润湿性。栅极介质表面瞬时等离子体处理导致阈值电压漂移约1 V,迁移率降低50%。另一方面,长时间等离子体处理90 s后,阈值电压几乎恢复到初始值-0.3 V。等离子体处理的TFT在2.5V的低工作电压下工作,迁移率为0.06 cm/ v。等离子体改善了栅极绝缘子表面的润湿性,在2.5 V电压下,采用滴铸半导体的TFT表面的迁移率为0.003 cm/Vs。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Oxygen plasma treatment for wettability improvement of alkyl terminal self-assembled monolayer as gate dielectrics
We have improved wettability on alkyl self-assembled monolayer (SAM) with oxygen plasma treatment. Momentary plasma treatment onto gate dielectric surface causes threshold voltage shift of about 1 V and 50 % degradation of mobility. On the other hand, after long-time plasma treatment for 90 s, threshold voltage returns to almost initial value of -0.3 V. TFT with plasma treatment works within low operation voltage of 2.5V with mobility of 0.06 cm/Vs. Wettability of gate insulator surface is improved by plasma, and a TFT using drop cast semiconductor on lyophilic insulator surface shows mobility of 0.003 cm/Vs at 2.5 V.
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