热管系统的数学建模与优化

N. Sokolov
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引用次数: 0

摘要

以解决单热源模型问题为例,给出了集成热管系统支撑结构中内置单平面热管的某块机载电子设备支撑结构的优化结果。在相同的温度、占用体积和一定的最高温度下,对无线电电气产品进行了比较。给出了计算模型的结果,比较了单个平面热管与顺序布置的平面热管系统的特性。最终,通过研究确定了不同热载体的单热管、二级热管和三级热管系统的去除热功率的极限值。数学模型的通用性得到了证实,并辅以优化方法
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mathematical Modeling and Optimization Heat Pipe Systems
The results of optimization of the supporting structure of a block of onboard electronic equipment with a built-in single flat heat pipe in the supporting structure with an integrated heat pipe system are presented, using the example of solving a model problem with a single heat source. The comparison was carried out at an equal temperature, occupied volume and for a certain maximum temperature of electrical radio products. The results of computational modeling are presented, demonstrating a comparison of the characteristics of a single flat heat pipe with a system of sequentially located flat heat pipes. Ultimately, the studies carried out have determined the limiting values of the removed thermal power of a single heat pipe, two-level and three-level heat pipe systems with different heat carriers. The versatility of the mathematical model, supplemented by the optimization method, has been confirmed
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