Weiqing Li, Lei Jin, Jiaqiang Yang, Zhaofu Wang, Fang-Zu Yang, Dongping Zhan, Z. Tian
{"title":"添加剂对新型电子镀铜系统电沉积及镀层结构的影响","authors":"Weiqing Li, Lei Jin, Jiaqiang Yang, Zhaofu Wang, Fang-Zu Yang, Dongping Zhan, Z. Tian","doi":"10.7503/CJCU20210225","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":9791,"journal":{"name":"高等学校化学学报","volume":"5 1","pages":"2919"},"PeriodicalIF":0.7000,"publicationDate":"2021-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating\",\"authors\":\"Weiqing Li, Lei Jin, Jiaqiang Yang, Zhaofu Wang, Fang-Zu Yang, Dongping Zhan, Z. Tian\",\"doi\":\"10.7503/CJCU20210225\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":9791,\"journal\":{\"name\":\"高等学校化学学报\",\"volume\":\"5 1\",\"pages\":\"2919\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2021-09-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"高等学校化学学报\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.7503/CJCU20210225\",\"RegionNum\":4,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"高等学校化学学报","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.7503/CJCU20210225","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}