辐射引起的软误差:芯片级建模视角

Q1 Computer Science
N. Seifert
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引用次数: 33

摘要

芯片级软误码率估计有两种方法:直接实验测量和仿真。由于SER缓解决策需要在产品设计周期的早期做出,远在产品Si可用之前,因此基于芯片级辐射引起的软错误率的快速且合理准确的模拟方法对于最终产品的可靠性和成功至关重要。以下贡献总结了作者认为相关的选定出版物,以实现真正的芯片级辐射诱导的软错误率估计方法。尽管所描述的策略和概念考虑了批量CMOS技术制造的微处理器,但没有根本原因说明它们不能应用于其他技术和不同类型的集成电路(ic)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Radiation-induced Soft Errors: A Chip-level Modeling Perspective
Chip-level soft-error rate (SER) estimation can come from two sources: direct experimental measurement and simulation. Because SER mitigation decisions need to be made very early in the product design cycle, long before product Si is available, a simulation-based methodology of chip-level radiation-induced soft error rates that is fast and reasonably accurate is crucial to the reliability and success of the final product. The following contribution summarizes selected publications that are deemed relevant by the author to enable a truly chip-level radiation-induced soft error rate estimation methodology. Although the strategies and concepts described have microprocessors manufactured in bulk CMOS technologies in mind, there is no fundamental reason why they cannot be applied to other technologies and different types of integrated circuits (ICs).
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来源期刊
Foundations and Trends in Electronic Design Automation
Foundations and Trends in Electronic Design Automation ENGINEERING, ELECTRICAL & ELECTRONIC-
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期刊介绍: Foundations and Trends® in Electronic Design Automation publishes survey and tutorial articles in the following topics: - System Level Design - Behavioral Synthesis - Logic Design - Verification - Test - Physical Design - Circuit Level Design - Reconfigurable Systems - Analog Design Each issue of Foundations and Trends® in Electronic Design Automation comprises a 50-100 page monograph written by research leaders in the field.
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