采用热压缩键合技术在细间距(≤10µm)处进行异质集成

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) Pub Date : 2017-06-01 DOI:10.1109/ECTC.2017.240

A. Bajwa, SivaChandra Jangam, Saptadeep Pal, N. Marathe, T. Bai, T. Fukushima, M. Goorsky, S. Iyer

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引用次数: 59

摘要

封装和电路板尺寸的缩放是异构系统集成的核心。我们描述了我们的无焊直接金属对金属低压(20mpa)。结合减少介子互连间距，介子到介子间距和走线间距将使摩尔定律适用于封装。

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Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding

The scaling of package and circuit board dimensions is central to heterogeneous system integration. We describe our solderless direct metal-to-metal low pressure ( 20 MPa. The combined reduction of dielet interconnect pitch, dielet-to-dielet spacing and trace pitch will enable a Moore's law for packaging.

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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