用于各种应用的银膏封装级EMI屏蔽技术

Kisu Joo, Tae-Ryong Kim, Jung-Woo Hwang, Jin-Ho Yoon, Se Young Jeong, M. Yim
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引用次数: 10

摘要

为了获得最佳的电阻率和机械可靠性,对不同形状的银颗粒进行了测试。研究了喷雾机的压力、速度、液滴大小等参数对喷涂导电膜均匀性的影响。得到的银膏含有片状银颗粒,其导电性约为1×10-7m。所得导电膜在EMC模具上的上、侧涂层厚度宽高比为1:0.5~1:0.7,可控制。我们发现,仅使用片状银时,电导率和机械可靠性最好。最后,采用ASTM方法,在膜厚为5um、10um、20um时,银和基体制成的EMI屏蔽膜的屏蔽效能分别高达60dB、65dB、70dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Package-Level EMI Shielding Technology with Silver Paste for Various Applications
A variety of shaped Ag particles was tested to obtain optimized electrical resistivity and mechanical reliability. We also studied the effect of the spray machine's parameters such as pressure, speed, and droplet size on uniformity of sprayed conductive film. The resulting Ag paste containing flake shaped Ag particles showed about 1×10-7m electrical conductivity. The aspect ratio of top to side coating thickness of the resulting conductive films on EMC mold was 1:0.5~1:0.7, which could be controllable. We found that the best electrical conductivity and mechanical reliability was achieved when only flake shaped Ag were used. Finally, shield effectiveness of resulting EMI shielding film made of Ag and matrix is as high as 60dB, 65dB, 70dB at 5um, 10um, 20um-thick film, respectively by ASTM method.
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