{"title":"考虑接触热阻的多层材料有效导热系数的反演","authors":"Chunyun Zhang, Zheng He, Lv Jun, Kun Liu, M. Cui","doi":"10.1115/1.4062306","DOIUrl":null,"url":null,"abstract":"\n Multilayer materials have been widely used in engineering applications, attributed to excellent thermo-mechanical performances. However, the thermal or mechanical properties of multilayer materials remain elusive, owing to contact behaviors etc. factors. In order to address this issue, an innovative method is employed to estimate the effective thermal conductivity (ETC) of multilayer materials considering thermal contact resistance (TCR) between layers, and the equivalence performance is investigated by solving three-dimensional inverse heat conduction problems. First, the equivalence method is validated by available experimental data of a multilayered insulation composite material. Then, the precision of different equivalence methods is compared, and the results indicate that the anisotropic equivalence method has higher accuracy than the isotropic and orthotropic equivalences for the 5-layer material in the present work. Finally, the robustness and stability of the anisotropic equivalence method are evaluated in detail. The present work provides a new alternative method for predicting the effective thermal conductivity of multilayer materials.","PeriodicalId":15937,"journal":{"name":"Journal of Heat Transfer-transactions of The Asme","volume":"28 13 1","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2023-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Inverse Estimation of Effective Thermal Conductivity of Multilayer Materials Considering Thermal Contact Resistance\",\"authors\":\"Chunyun Zhang, Zheng He, Lv Jun, Kun Liu, M. Cui\",\"doi\":\"10.1115/1.4062306\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Multilayer materials have been widely used in engineering applications, attributed to excellent thermo-mechanical performances. However, the thermal or mechanical properties of multilayer materials remain elusive, owing to contact behaviors etc. factors. In order to address this issue, an innovative method is employed to estimate the effective thermal conductivity (ETC) of multilayer materials considering thermal contact resistance (TCR) between layers, and the equivalence performance is investigated by solving three-dimensional inverse heat conduction problems. First, the equivalence method is validated by available experimental data of a multilayered insulation composite material. Then, the precision of different equivalence methods is compared, and the results indicate that the anisotropic equivalence method has higher accuracy than the isotropic and orthotropic equivalences for the 5-layer material in the present work. Finally, the robustness and stability of the anisotropic equivalence method are evaluated in detail. The present work provides a new alternative method for predicting the effective thermal conductivity of multilayer materials.\",\"PeriodicalId\":15937,\"journal\":{\"name\":\"Journal of Heat Transfer-transactions of The Asme\",\"volume\":\"28 13 1\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2023-04-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Heat Transfer-transactions of The Asme\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4062306\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Heat Transfer-transactions of The Asme","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4062306","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Inverse Estimation of Effective Thermal Conductivity of Multilayer Materials Considering Thermal Contact Resistance
Multilayer materials have been widely used in engineering applications, attributed to excellent thermo-mechanical performances. However, the thermal or mechanical properties of multilayer materials remain elusive, owing to contact behaviors etc. factors. In order to address this issue, an innovative method is employed to estimate the effective thermal conductivity (ETC) of multilayer materials considering thermal contact resistance (TCR) between layers, and the equivalence performance is investigated by solving three-dimensional inverse heat conduction problems. First, the equivalence method is validated by available experimental data of a multilayered insulation composite material. Then, the precision of different equivalence methods is compared, and the results indicate that the anisotropic equivalence method has higher accuracy than the isotropic and orthotropic equivalences for the 5-layer material in the present work. Finally, the robustness and stability of the anisotropic equivalence method are evaluated in detail. The present work provides a new alternative method for predicting the effective thermal conductivity of multilayer materials.
期刊介绍:
Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.