P. Mendes, A. Polyakov, M. Bartek, J. Burghartz, J. Correia
{"title":"用于无线微系统的集成折叠贴片天线","authors":"P. Mendes, A. Polyakov, M. Bartek, J. Burghartz, J. Correia","doi":"10.1109/ICSENS.2004.1426206","DOIUrl":null,"url":null,"abstract":"A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4/spl times/4/spl times/1 mm/sup 3/, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.","PeriodicalId":20476,"journal":{"name":"Proceedings of IEEE Sensors, 2004.","volume":"29 1","pages":"485-488 vol.1"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"An integrated folded-patch antenna for wireless microsystems\",\"authors\":\"P. Mendes, A. Polyakov, M. Bartek, J. Burghartz, J. Correia\",\"doi\":\"10.1109/ICSENS.2004.1426206\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4/spl times/4/spl times/1 mm/sup 3/, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.\",\"PeriodicalId\":20476,\"journal\":{\"name\":\"Proceedings of IEEE Sensors, 2004.\",\"volume\":\"29 1\",\"pages\":\"485-488 vol.1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Sensors, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSENS.2004.1426206\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Sensors, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSENS.2004.1426206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An integrated folded-patch antenna for wireless microsystems
A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4/spl times/4/spl times/1 mm/sup 3/, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.