热贴合:通过超材料结构热成型智能矫形器,用于身体贴合和部件调整

Guanyun Wang, Yue Yang, Mengyan Guo, Kuang-ji Zhu, Zihan Yan, Qiang Cui, Zihong Zhou, Junzhe Ji, Jiaji Li, Danli Luo, Deying Pan, Yitao Fan, Teng Han, Ye Tao, Lingyun Sun
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引用次数: 2

摘要

智能矫形器在智能康复监测和训练方面具有巨大的潜力。然而,大多数这些电子辅助设备通常难以日常使用,并且难以修改以适应身体形状和医疗需求的变化。对于现有的临床医生来说,这些智能设备的定制流程带来了巨大的学习成本。本文介绍了ThermoFit,这是一种端到端热成型智能矫形器的设计和制造管道,符合临床接受的程序。ThermoFit使智能矫形器的形状和电子位置符合人体,并通过将低成本低温热塑性塑料(lttp)与定制的超材料结构和电子元件集成在一起,实现快速迭代。具体来说,ltps中使用了三种类型的超材料结构,以减少热成型过程中产生的皱纹,并允许组件位置调整和关节运动。设计工具原型有助于生成超材料图案和优化组件放置和电路路由。三个应用表明,ThermoFit可以在不同的可穿戴设备上成形。最后,与临床医生的实践研究验证了热成型智能矫形器的用户友好性,技术评估证明了制造效率和电子连续性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ThermoFit: Thermoforming Smart Orthoses via Metamaterial Structures for Body-Fitting and Component-Adjusting
Smart orthoses hold great potential for intelligent rehabilitation monitoring and training. However, most of these electronic assistive devices are typically too difficult for daily use and challenging to modify to accommodate variations in body shape and medical needs. For existing clinicians, the customization pipeline of these smart devices imposes significant learning costs. This paper introduces ThermoFit, an end-to-end design and fabrication pipeline for thermoforming smart orthoses that adheres to the clinically accepted procedure. ThermoFit enables the shapes and electronics positions of smart orthoses to conform to bodies and allows rapid iteration by integrating low-cost Low-Temperature Thermoplastics (LTTPs) with custom metamaterial structures and electronic components. Specifically, three types of metamaterial structures are used in LTTPs to reduce the wrinkles caused by the thermoforming process and to permit component position adjustment and joint movement. A design tool prototype aids in generating metamaterial patterns and optimizing component placement and circuit routing. Three applications show that ThermoFit can be shaped on bodies to different wearables. Finally, a hands-on study with a clinician verifies the user-friendliness of thermoforming smart orthosis, and technical evaluations demonstrate fabrication efficiency and electronic continuity.
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