高密度互连印刷电路板孔金属化的研究与进展

Wang Zhao-yun, J. Lei, Yang Jia-qiang, Lian Wei-qing, Zhang Dong-ping, Yan G Fang-zu, Sun Shi-gang
{"title":"高密度互连印刷电路板孔金属化的研究与进展","authors":"Wang Zhao-yun, J. Lei, Yang Jia-qiang, Lian Wei-qing, Zhang Dong-ping, Yan G Fang-zu, Sun Shi-gang","doi":"10.13208/J.ELECTROCHEM.201119","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":15595,"journal":{"name":"电化学","volume":"63 1","pages":"212"},"PeriodicalIF":0.0000,"publicationDate":"2021-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Studies and Progresses on Hole Metallization in High-density interconnected Printed Circuit Boards\",\"authors\":\"Wang Zhao-yun, J. Lei, Yang Jia-qiang, Lian Wei-qing, Zhang Dong-ping, Yan G Fang-zu, Sun Shi-gang\",\"doi\":\"10.13208/J.ELECTROCHEM.201119\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":15595,\"journal\":{\"name\":\"电化学\",\"volume\":\"63 1\",\"pages\":\"212\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-03-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"电化学\",\"FirstCategoryId\":\"1089\",\"ListUrlMain\":\"https://doi.org/10.13208/J.ELECTROCHEM.201119\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"电化学","FirstCategoryId":"1089","ListUrlMain":"https://doi.org/10.13208/J.ELECTROCHEM.201119","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

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Studies and Progresses on Hole Metallization in High-density interconnected Printed Circuit Boards
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来源期刊
CiteScore
2.90
自引率
0.00%
发文量
2423
期刊介绍: The journal "Electrochemistry (Chinese and English)" is an academic journal supervised by the China Association for Science and Technology, co-sponsored by the Chinese Chemical Society and Xiamen University, and co-sponsored by the State Key Laboratory of Physical Chemistry of Solid Surfaces of Xiamen University, Huizhou Yiwei Lithium Energy Co., Ltd., and the National Engineering Research Center for Electrochemical Energy Storage Technology. It is publicly distributed at home and abroad, aiming to timely reflect the latest scientific research results and trends in the field of electrochemistry in my country and promote academic exchanges at home and abroad. It has columns such as review, research papers, and research briefs.
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