65nm工艺中寄存器文件工艺变化的研究

M. Arulvani, S. S. Karthikeyan, N. Neelima
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引用次数: 3

摘要

现代片上存储器越来越需要更高的性能,更低的功耗和改进的鲁棒性与缩小的特征尺寸。预计在SRAM等存储器中常用的先进工艺技术中,工艺变化将更加明显。关键工艺参数(如阈值电压或有效通道长度)的变化可能导致存储器中出现大量故障单元。这些变化可能导致降低最大可达到的工作频率,产量和电路性能。本文研究了错配和工艺变化对标准6T电池的影响。在此基础上,设计了一种基于65nm工艺的6晶体管SRAM寄存器,并研究了该寄存器在工艺变化下的漏功率和性能。对寄存器文件的每个条目进行性能退化分析,并在由于延迟和泄漏导致的过程变化下识别出清晰、部分受影响和完全受影响的寄存器。随机变化本身是过程变化的主要原因,因此建模。研究发现,存取时间随寄存器文件大小的增加而增加,过程变化时的泄漏功率比系统未受影响时的泄漏功率大22倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of process variation on register files in 65nm technology
Modern on-chip memories demand a increasing need for higher performance, lower power consumption and improved robustness with shrinking feature size. The process variations are expected to be more pronounced in advanced process technology commonly used in memories such as SRAM. Variations in the critical process parameters such as threshold voltage or effective channel length can result in large number of faulty cells in a memory. These variations can result in reduced maximum attainable operating frequency, yield and circuit performance. In this paper, the impact of mismatch and process-variation on standard 6T cell is investigated. Then a register file is designed in 65nm Technology with six-transistor SRAM and investigated for the leakage power and performance under process variation. Each entry of the register file is analyzed for the performance degradation and clear, partially affected and fully affected registers are identified under process variation due to delay and leakage. Random variation alone is modeled as they are the dominant cause of process variation. It is found that the access time increases with the size of the register file and the leakage power under process variation is 22 times larger than the normal leakage power with unaffected system.
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